Presentation at the 21st Materials Workshop | The true value and future prospects revealed through the thorough use of Matlantis

Taisuke Hasegawa, application scientist Matlantis Corporation, will be giving a talk at the 21st Materials Workshop - From "Fugaku" to Post-"Fugaku": Prospects for Next-Generation Materials Simulation - hosted by the Research Organization for Information Science and Technology.

Presentation title

The true value and future prospects revealed through the thorough use of Matlantis

Matlantis PFP is an MLIP whose basic outputs are energy and force, but by devising computational methods, it is possible to evaluate a wide range of physical properties. In this presentation, we will share the current usage situation through specific analysis examples and consider the role and prospects of this tool in future material development.

Presenter

Taisuke Hasegawa

Ph.D., is a Customer Success Engineer at Matlantis Corporation. 

Application Scientist
He graduated from the Department of Chemistry, Faculty of Science, Nagoya University, and earned his Ph.D. from the Department of Chemistry, Graduate School of Science, Kyoto University. Throughout his career, he has held postdoctoral research positions at several prestigious institutions, including the Max Planck Institute for the Structure and Dynamics of Matter, Kyoto University, and the National Institute for Materials Science (NIMS). After serving as a Specially Appointed Associate Professor at Hokkaido University and a Senior Researcher at the Center for Computational Sciences, University of Tsukuba, he joined Matlantis Corporation. He currently specializes in Customer Success, leveraging his extensive research expertise in computational chemistry to support and empower users.

【Outline】※ This webinar will be conducted in Japanese only.

Date and time: Wednesday, February 25, 2026, 10:00-17:30 (event)
Venue: Hybrid event held on-site (Akihabara UDX) and online (Zoom)
Participation fee: Free
Organized by: Research Organization for Information Science and Technology
Event details and application
For more details about the event and to apply, please see the link below.
https://www.hpci-office.jp/events/symposia/ws_material_260225